Hermes is a machine-to-machine communication standard used in the SMT assembly industry.[1]
IPC-HERMES-9852
It is a successor to the SMEMA standard, introducing improvements such as: simpler physical wiring (Ethernet), use of popular data transmission formats (TCP/IP and XML), reduced number of barcode scanners (required only once at the beginning of the line), transmission of board data (such as barcodes & dimensions) to downstream machines.[2]
By the end of 2018 IPC has confirmed to recognize The Hermes Standard to be the successor to “the SMEMA Standard” IPC-SMEMA-9851, which has been the only globally accepted and broadly established standard for machine to machine communication in SMT with regards to PCB handover. Accordingly, The Hermes Standard was assigned an IPC naming code: It can now officially be referred to as IPC-HERMES-9852.[3]
The actual version, IPC-HERMES-9852, version 1.5[4] version 1.2[5] provides an electrical SMEMA interface replacement and extends the interface to communicate such things as unique identifiers for handled printed boards, equipment identifiers of the first machine noticing a printed board, barcodes, conveyor speed and specific information about the product type.
Industry acceptance
The initiative was started by two companies: ASM and ASYS; by April 2017, 17 companies had joined.[6] On November 14, 2017, Hermes received a Global SMT&Packaging Award in the category “Software Process Control” at Productronica in Munich, Germany.[7] As of November 2021, 62 companies are members of the initiative.
4IR.UK British Systems
6TL Engineering
Achat Engineering GmbH
allSMT
ASM Assembly Systems GmbH
Asscon
ASYS Automatisierungssysteme GmbH
BESI
Bright Machines
BTU
CKD
CTI Systems
CTS
CYBEROPTICS
Digitaltest
ECD
Essemtec
EUNIL
Eunil Co., Ltd.
Exelsius
Famecs
FlexLink
GKG
GÖPEL electronic GmbH
Hanwha
Heller Industries
Innomelt
IPTE
IBL-Löttechnik GmbH
ITW EAE
JAPAN UNIX Co. Ltd.
JOT Automation Kft.
Keysight Technologies
KIC
KOH YOUNG Technology Inc.
kolb Cleaning Technology GmbH
Kulicke & Soffa
Kurtzersa
Magic Ray Technology
MIRTEC
MYCRONIC
Nordson ASYMTEK & MATRIX
Nutek Europe B.V.
OMRON Corporation
OSAI
PARMI
Pemtron
Rehm Thermal Systems GmbH
Rejoint
RG Elektrotechnologie
SEICA SpA & SEICA Automation
SAKI Corp
Scheid IT
SEHO Systems
SICK AG
SMT-Wertheim
SolderStar
Sonic Technology
SPEA S.p.A.
SYNEO
Test Research, Inc. (TRI)
Takaya
Universal Instruments
VISCOM AG
ViTrox
YJ Link Co., Ltd.
YXLON
Specification
Munich, April 2017 release of Version 1.0
Munich, November 2017 release of Version 1.0 Revision 1
Shanghai, April 2018 release of Version 1.1
San Diego, January 2019 release of Version 1.2
Online, March 2021 release of Version 1.3
Munich and Online, November 2021 release of Version 1.4
Online, June 2022, release of version 1.5
Anaheim and Online, April 2024, release of version 1.6
Shenzhen and Online, November 2024, release of version 1.7
The specification is freely available for download from the project website.[4] At the same time, the standard is available in the IPC Online Shop.[5]
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